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    1 Article
    Chemie ×
    Release films for mold making, electrical engineering and chemistry
    Dehesive surfaces are used wherever the adhesion of substances must be avoided. They enable the demolding of e.g. GRP components, the sealing of roasting rods during baking or the separation of sticky...
    Chemie Elektrotechnik Formenbau Trennfolien
    Sep 20, 2018
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